JPH0268114U - - Google Patents
Info
- Publication number
- JPH0268114U JPH0268114U JP14776888U JP14776888U JPH0268114U JP H0268114 U JPH0268114 U JP H0268114U JP 14776888 U JP14776888 U JP 14776888U JP 14776888 U JP14776888 U JP 14776888U JP H0268114 U JPH0268114 U JP H0268114U
- Authority
- JP
- Japan
- Prior art keywords
- mold
- molds
- cavity
- lead frame
- required number
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000011347 resin Substances 0.000 claims description 4
- 229920005989 resin Polymers 0.000 claims description 4
- 239000000463 material Substances 0.000 claims description 3
- 238000007789 sealing Methods 0.000 claims description 3
- 230000002093 peripheral effect Effects 0.000 claims 2
- 238000003466 welding Methods 0.000 description 1
Landscapes
- Moulds For Moulding Plastics Or The Like (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988147768U JPH058106Y2 (en]) | 1988-11-11 | 1988-11-11 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988147768U JPH058106Y2 (en]) | 1988-11-11 | 1988-11-11 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0268114U true JPH0268114U (en]) | 1990-05-23 |
| JPH058106Y2 JPH058106Y2 (en]) | 1993-03-01 |
Family
ID=31418477
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988147768U Expired - Lifetime JPH058106Y2 (en]) | 1988-11-11 | 1988-11-11 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH058106Y2 (en]) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008149677A (ja) * | 2006-12-20 | 2008-07-03 | Sumitomo Heavy Ind Ltd | 樹脂封止金型 |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5147369A (en) * | 1974-10-21 | 1976-04-22 | Hitachi Ltd | Jushifushi nyoru handotaisochino seizoho |
| JPS54152970A (en) * | 1978-05-24 | 1979-12-01 | Hitachi Ltd | Resin-molding method, mold and molded body |
| JPS56154046U (en]) * | 1980-04-10 | 1981-11-18 | ||
| JPS61146517A (ja) * | 1984-12-20 | 1986-07-04 | Sanyo Electric Co Ltd | 半導体装置の樹脂封止用金型 |
| JPS6451326A (en) * | 1987-08-21 | 1989-02-27 | Toa Nenryo Kogyo Kk | Production of superconducting material |
-
1988
- 1988-11-11 JP JP1988147768U patent/JPH058106Y2/ja not_active Expired - Lifetime
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5147369A (en) * | 1974-10-21 | 1976-04-22 | Hitachi Ltd | Jushifushi nyoru handotaisochino seizoho |
| JPS54152970A (en) * | 1978-05-24 | 1979-12-01 | Hitachi Ltd | Resin-molding method, mold and molded body |
| JPS56154046U (en]) * | 1980-04-10 | 1981-11-18 | ||
| JPS61146517A (ja) * | 1984-12-20 | 1986-07-04 | Sanyo Electric Co Ltd | 半導体装置の樹脂封止用金型 |
| JPS6451326A (en) * | 1987-08-21 | 1989-02-27 | Toa Nenryo Kogyo Kk | Production of superconducting material |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008149677A (ja) * | 2006-12-20 | 2008-07-03 | Sumitomo Heavy Ind Ltd | 樹脂封止金型 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH058106Y2 (en]) | 1993-03-01 |